TRIBOLOGICAL PROPERTIES OF TUNGSTEN THIN FILMS DEPOSITED BY TVA ON SILICON SAMPLES AND ON GLASS SUBSTRATES
Pages 175-179
R. Vladoiu, V. Bursikova, A. Stoica, A. Mandes, G. Musa
Abstract
This paper is focused on the investigation of mechanical properties of tungsten thin film produced by Thermionic Vacuum Arc. The indentation tests were performed using the Fischerscope H100 DSI tester equipped with Vickers indenter. This tester enables to register the indentation depth as a function of the applied load during both the loading and unloading part of the indentation test. The applied load L ranges from 0.4mN to 1N and the accuracy of the depth measurement is of about ±1nm. The elastic modulus obtained on glass samples using depth sensing indentation test was lower, than that of for bulk tungsten. The obtained values are significantly influenced with the substrate hardness. Tungsten film W was deposited on silicon substrate also. This film did not delaminate. The hardness obtained on this film at low indentation depth was a little bit lower, than in case of films on glass substrate because of lower intrinsic stress. On the other hand the elastic modulus was higher, because higher elastic modulus of the silicon substrate compared to the glass substrate.